Solder Paste Joint Fatigue Life Model
Component soldering generally requires the use of solder paste as a connecting medium, which forms solder joints after reflow. Due to various impacts that the component may encounter during its regular use, the stress on···
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Introduction to PCB Chemical Tin Plating Process
The chemical tin plating process is a non-electroplating process that deposits tin on the surface of copper. Its working principle is to use the higher activity of tin than copper in acid solution, so that a displacement···
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The Relationship between Reliability of LED Packaging and Voids
Display devices such as televisions and computers have become almost a necessity in every household in daily life. LED packaging technology is essential for the production of display products. In order to achieve a bette···
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