Leaded Solder Preforms
High Lead Solder Preforms with 4n Alloy Purity for Die Attach Sn5pb95
The amount of solder can be accurately increased by placing the preformed solder strip packed with TONG FANG tape in the solder paste. Only part of the preformed solder pieces need to be contacted with the solder paste, thus greatly improving the flexibility of the operation. The contact between lea
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The amount of solder can be accurately increased by placing the preformed solder strip packed with TONG FANG tape in the solder paste. Only part of the preformed solder pieces need to be contacted with the solder paste, thus greatly improving the flexibility of the operation. The contact between lead-free preformed solder and solder paste shall not be less than 25%, while the contact between lead containing preformed solder and solder paste shall not be less than 10%.
When the air returns, the preformed solder can increase the amount of solder paste by 4 times without over diluting the flux. It can be increased to 10 times when nitrogen returns.
| /Leaded tin sheet/tin ring/ | Sn63Pb37 | 183 | 0.146 | 51 | 25 | 52 |
| Sn60Pb40 | 183-190 | 50 | ||||
| Sn62Pb36Ag2 | 178 | 0.145 | 42 | 27 | 44 | |
| Sn5Ag2.5Pb92.5 | 287-296 | 0.2 | 26 | 24 | 29.03 | |
| Sn10Pb88Ag2 | 278 | 0.185 | 23 | |||
| Sn10Pb90 | 275-302 | 0.195 | ||||
| /Lead-free tin sheet/tin ring/ | Sn96.5Ag3.0Cu0.5 | 217 | 0.132 | 58 | 21 | 50 |
| Sn98.5Ag1.0Cu0.5 | 220 | 0.133 | 60 | 43 | ||
| Sn-Ag4.0-Cu0.5 | 217-220 | 0.132 | 62 | 51.5 | ||
| Sn95.5Ag3.8-Cu0.7 | 217-220 | 0.132 | 57 | 22 | 48 | |
| Sn99Ag0.3Cu0.7 | 227 | 0.133 | 60 | 20 | 40 | |
| Sn96.5Ag3.5 | 221 | 0.108 | 33 | 30 | 39 | |
| Sn99.3Cu0.7 | 227 | 0.133 | 64 | 26 | 34.5 | |
| Sn100 | 232 | 0.111 | 73 | 24 | 13.1 | |
| Sn95Sb5 | 245-250 | 0.145 | 28 | 31 | 40.7 | |
| Sn90Sb10 | 245-266 | 0.149 | 42 | 31 | 40.7 | |
| Sn42Bi58 | 138 | 0.383 | 19 | 15 | 55.16 | |
| Sn-In52 | 118 | 0.147 | 34 | 20 | 12 | |
| In-Bi33.7 | 72 | 0.422 | 26 | |||
| Sn-In51-Bi32.5 | 60 | 0.522 | 22 | 33.4 |
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High Lead Solder Preforms with 4n Alloy Purity for Die Attach Sn5pb95
The amount of solder can be accurately increased by placing the preformed solder strip packed with TONG FANG tape in the solder paste. Only part of the preformed solder pieces need to be contacted with the solder paste, ···
Learn More
