through-hole soldering applications, as well as eliminating wave soldering Reduces flux/paste ratio in standard solder pastes, thereby reducing flux residues Reduces the need for overprinting of solder paste, thereby reducing flux and solder beading Eliminate the use of stepped stencils Compatible with standard SMD component database Compatible with standard pick and place nozzles Available in all standard solder pastes combined application: Placing TONG FANG tape-and-reel preformed solder sheets in the solder paste can precisely increase the amount of solder. Only a portion of the preformed solder sheet is in contact with the solder paste, which greatly increases the flexibility of the operation. Lead-free solder preforms must not be less than 25% in contact with solder paste, and lead-containing preforms must not be less than 10% in contact with solder paste. In air reflow, solder preforms can increase the solder volume by a factor of 4 without overly diluting the flux. It can be increased by a factor of 10 under nitrogen reflux.