Product Description

Sac305 preformed solder strip Sn-AG3.0cu0.5 lead-free environment-friendly eutectic solder ring square tin strip

Tape and Reel Preforms provide an easy way to increase the amount of solder for assembly applications using solder paste. These rectangular solder tabs do not contain flux, but can be reflowed with flux in the solder paste. Simply place rectangular solder tabs into the solder paste to precisely increase the amount of solder. The entire line of tape-and-reel rectangular solder lugs can be placed in standard placement equipment, utilizing industry standard placement processes. A variety of solder volumes are available, providing maximum flexibility and cost-effectiveness, as a single solder preform can add precisely the amount of solder required.
 
Features: 0402/0603/0805/0202/0201 size rectangular solder tabs, as well as many other sizes of preformed solder tabs, can be used with solder paste. Flux-free, but can rely on flux in the solder paste for reflow. Alloys are highly flexible, including general lead-free and lead-containing alloys for printed circuit board packaging. Available for half-height solder tabs - 0402H, 0603 and 0805 - ideal for ground-supported connectors. Quick placement with standard equipment Available in 7" and 13" IEC reel packaging advantage: Shorten time-to-market and eliminates solder shortages without changing PCB design Precisely increase solder volume Perfect for through-hole soldering applications, as well as eliminating wave soldering Reduces flux/paste ratio in standard solder pastes, thereby reducing flux residues Reduces the need for overprinting of solder paste, thereby reducing flux and solder beading Eliminate the use of stepped stencils Compatible with standard SMD component database Compatible with standard pick and place nozzles Available in all standard solder pastes combined application: Placing TONG FANG tape-and-reel preformed solder sheets in the solder paste can precisely increase the amount of solder. Only a portion of the preformed solder sheet is in contact with the solder paste, which greatly increases the flexibility of the operation. Lead-free solder preforms must not be less than 25% in contact with solder paste, and lead-containing preforms must not be less than 10% in contact with solder paste. In air reflow, solder preforms can increase the solder volume by a factor of 4 without overly diluting the flux. It can be increased by a factor of 10 under nitrogen reflux.