Product Description

Yoshida Welding uses the newly developed precision ball making technology to produce high precision spherical solder, and at the same time, it adds a small amount of additives to improve the heat resistance, fatigue and jointing performance. It is suitable for semiconductor BGA, MCM, CSP, Flip Chip and other advanced IC packages and microelectronic harnesses, optoelectronic devices and micro welding applications. From the smelting and manufacturing of metal alloy with special technology to customized research and development to meet the diversified needs of customers, precision ball making technology can produce high-quality solder balls with a diameter of 0.05mm-0.76mm.
Product features:
Stable solder ball size and composition ensure high yield during remanufacturing.
High precision screening and grading technology improves size uniformity.
The precision ball making technology makes the tin ball have high roundness and surface uniformity.
Impact resistant and highly reliable solder ball
1. Applicable
It is suitable for semiconductor BGA, CSP chip package repair, microelectronic wiring harness, optoelectronic devices and other connections.
2. Product characteristics
Project quality specification
1 Appearance silver, bright spherical solid
2. Typical composition: soft solder alloy
Type Alloy melting point
 

4. Quality
4-1 Appearance
Visual judgment. Silver metal sphere.
4-2 Material composition and impure substances
Inductively coupled plasma atomic emission spectrometer was used to analyze the element content. The content of tin, silver and copper was controlled within ± 0.5, ± 0.2 and ± 0.2 of the standard content respectively. Lead content of harmful elements shall be controlled within 500ppm, and cadmium, mercury and hexavalent chromium shall be controlled below 2ppm.
4-3 Oxygen content
The oxygen content is controlled within 0.01% by using a precision oxidation analyzer
4-4 Diameters and Tolerances
The image measuring system is used for testing, and the tolerance is controlled within 0.008mm - 0.020mm
4-5 Warranty period: sealed for 18 months (stored at 10-20 ºC in a cool and dry place).
5. Product specification table (Sn96.5Ag3.0Cu0.5)
Diameter (mm) Tolerance (mm) Roundness (mm) Quantity per bottle (capsules)
0.889    ±0.020    <0.020    125000
0.760    ±0.020    <0.020    250000
0.650    ±0.020    <0.019    250000
0.600    ±0.020    <0.018    250000
0.550    ±0.020    <0.017    250000
0.500    ±0.015    <0.015    250000
0.450    ±0.015    <0.014    250000
0.400    ±0.015    <0.013    500000
0.350    ±0.010    <0.011    500000
0.300    ±0.010    <0.010    500000
0.250    ±0.008    <0.009    1000000
0.200    ±0.008    <0.009    1000000
0.150    ±0.007    <0.008    1000000
0.100    ±0.007    <0.008    1000000
0.050    ±0.006    <0.007    1000000
6. Packaging and marking
1) The packaging unit is bottle, and each bottle is divided into 250000 capsules, 500000 capsules and 1 million capsules
Packaging, bottles made of anti-static polyethylene
2) The above containers shall be transported in cartons at the time of delivery.
3) The label must indicate "product name", "diameter", "quantity"
(4) Save as
Store in a cool and dry place at 20-25 ºC and keep away from heat sources.